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Item #:
86581883
Black Multi-purpose BGA Reballing Stencils, Solder Steel Mesh Tin Planting Template, Template Mesh Directly Heat Kit Phone Rework Net for iPhone 6-15
Item #:
86581883
MWK 72559
Price Details
Excluding Shipping & Custom charges ( Shipping and custom charges will be calculated on checkout )
*All items will import from US
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In stock
Imported from USA store
QTY:
Order now and get it around Thursday, August 06
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Make your repair work easier with our Multi-purpose BGA Reballing Stencils, designed for precision and efficiency.
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Note: Step Down Voltage Transformer required for using electronics products of US store (110-120). Recommended power converters Buy Now.
What Stands Out
Precision Design
Engineered specifically for iPhone 6-15 series, ensuring accurate alignment and flawless repairs every time, simplifying the CPU reballing process.
Durable Material
Constructed from high-quality solder steel, this stencil withstands high temperatures and repeated use, making it a long-lasting addition to your repair toolkit.
Versatile Application
Multi-purpose design not only suitable for iPhones but adaptable for various CPU repairs, enhancing value and utility for professional repair technicians.
Product Details
| Item Weight | 1 lbs (450 grams) |
Who Should Buy?
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Professional Technicians
Highly effective for technicians specialized in mobile device repair, ensuring precision in reballing BGA components.
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DIY Enthusiasts
Ideal for hobbyists looking to repair iPhones themselves, offering tools for accurate soldering and maintenance.
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Repair Shops
Perfect for small repair shops needing reliable tools for fixing iPhone CPUs efficiently and effectively.
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Casual Users
Not suitable for average users who lack experience or tools for advanced phone repair tasks.
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Non-iPhone Models
Ineffective for users with devices outside the iPhone 6-15 range, limiting versatility and usability.
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Beginners in Repair
May overwhelm those new to electronics repair due to the complexity of the BGA reballing process.
Product Description
Black Multi-purpose BGA Reballing Stencils, Solder Steel Mesh Tin Planting Template, Template Mesh Directly Heat Kit Phone Rework Net for iPhone 6-15 Series CPU Repair Tools (7 7P)
Have any Query? Chat with us
Customer Questions & Answers
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Question:
What is the purpose of Black Multi-purpose BGA Reballing Stencils?
Answer: The Black Multi-purpose BGA Reballing Stencils are designed for the precise reballing of BGA components in various electronic devices, including iPhones. These stencils allow technicians to apply solder balls accurately and uniformly to BGA components, ensuring optimal connectivity during repair. This is crucial in device maintenance, particularly when addressing issues related to solder joint failures. Additionally, this stencil set is suitable for multiple iPhone models, providing versatility in repair environments. -
Question:
Can these stencils be used for other devices besides iPhones?
Answer: Yes, these stencils can be utilized for various electronic devices beyond iPhones, including tablets, laptops, and other smartphones that utilize BGA components. The flexibility in design makes them suitable for a range of BGA sizes and configurations. This adaptability is beneficial for repair technicians who handle diverse electronics, allowing them to achieve consistent repair quality across different devices. -
Question:
What materials are used in making these reballing stencils?
Answer: The Black Multi-purpose BGA Reballing Stencils are typically made from high-quality, durable steel mesh that can withstand the heat and pressure of reballing processes. This construction ensures that the stencils maintain their shape over multiple uses while delivering precise solder application each time. The robust material is also resistant to warping and damage, making it a reliable choice for repeated use in a busy repair shop. -
Question:
How do I clean the BGA reballing stencils after use?
Answer: Cleaning the BGA reballing stencils is straightforward. After use, gently wipe the stencil with a suitable cleaning solvent or isopropyl alcohol to remove any residual solder and flux. It’s important to use a soft cloth or brush to avoid scratching the stencil's surface. Regular maintenance not only preserves the integrity of the stencils but also ensures optimal performance in subsequent applications, minimizing the risk of defects. -
Question:
Are the stencils compatible with lead-free solder?
Answer: Yes, the Black Multi-purpose BGA Reballing Stencils are compatible with both lead and lead-free solder. This versatility is essential for modern electronic repairs, where lead-free solder has become standard due to environmental regulations. This compatibility allows technicians to use these stencils with a wide range of solder materials without compromising the quality of the reballing process. -
Question:
What is the thickness of the steel mesh used in these stencils?
Answer: The thickness of the steel mesh in the Black Multi-purpose BGA Reballing Stencils is typically designed to balance durability and flexibility. While the exact thickness may vary, it is engineered to maintain precision in solder ball placement while ensuring the stencil remains manageable for technicians. This balance helps prevent solder leakage and ensures accurate alignments, which are critical for successful repairs. -
Question:
How should I store the BGA reballing stencils to ensure longevity?
Answer: To ensure the longevity of the BGA reballing stencils, store them in a cool, dry place away from moisture and direct sunlight. It’s also advisable to keep them flat or hung without any pressure on them to avoid bending or warping. Proper storage helps maintain their shape and effectiveness, ensuring they perform well for multiple uses, and minimizing potential defects during the reballing process. -
Question:
What is included in the Black Multi-purpose BGA Reballing Stencils kit?
Answer: The Black Multi-purpose BGA Reballing Stencils kit usually includes various stencil sizes tailored for specific BGA configurations used in devices like the iPhone 6-15. Each kit is designed to meet the needs of tech repair professionals, providing a complete package for accurate solder ball deployment. This comprehensive offering simplifies the tooling needs and ensures that technicians have everything they require for effective reballing in one set. -
Question:
Can I buy Black Multi-purpose BGA Reballing Stencils in Malawi?
Answer: Yes, you can buy the Black Multi-purpose BGA Reballing Stencils directly from Ubuy in Malawi. Ubuy provides an extensive selection of electronic repair tools, including these stencils, making it a reliable destination for technicians and DIY enthusiasts. With a straightforward purchasing process and often an array of related products, Ubuy helps ensure you have all the necessary tools for your repair projects. -
Question:
What are the benefits of using steel mesh over traditional stencils?
Answer: Using steel mesh for BGA reballing stencils offers several advantages over traditional materials. Steel mesh provides greater durability and flexibility, allowing for consistent solder ball formation due to its fine aperture design. It also helps in maintaining the required thermal conductivity, which is crucial during the reballing process. As a result, technicians can achieve higher accuracy and reliability in repairs, leading to enhanced performance and longevity of the reworked components.
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MWK 72559
Order now and get it around Thursday, August 06
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Features & Benefits
- Designed for iPhone models from 6 to 15 series.
- Thickness of 0.12mm made with durable stainless steel.
- Specially designed for precise tin implantation and heat resistance.
- Ensures no deformation during high-temperature use.
- User-friendly for quick and easy reballing of BGA IC.
- A must-have tool for mobile phone repair professionals.
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